Impact of voids in interconnection materials

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Contributor : Catherine Cardon <>
Submitted on : Saturday, May 23, 2015 - 5:37:20 PM
Last modification on : Tuesday, May 14, 2019 - 11:05:42 AM

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  • HAL Id : insu-01154803, version 1

Citation

Pierre-Richard Dahoo, Malika Khettab, Christian Chong, Armelle Girard, Philippe Pougnet.. Impact of voids in interconnection materials. Abdelkhalak El Hami et Philippe Pougnet. Embedded Mechatronic Systems 2. Analysis of Failures, Modeling, Simulation and Optimization, Elsevier, Chapter 4, 2015, ISBN : 978-1-78548-014-0. ⟨insu-01154803⟩

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