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Book Sections Year : 2015

Impact of voids in interconnection materials

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Instrumentation and Methods for Astrophysic [astro-ph.IM] Materials and structures in mechanics [physics.class-ph]

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Submitted on : Saturday, May 23, 2015-5:37:20 PM

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insu-01154803 , version 1 (23-05-2015)

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Pierre-Richard Dahoo, Malika Khettab, Christian Chong, Armelle Girard, Philippe Pougnet.. Impact of voids in interconnection materials. Abdelkhalak El Hami et Philippe Pougnet. Embedded Mechatronic Systems 2. Analysis of Failures, Modeling, Simulation and Optimization, Elsevier, Chapter 4, 2015, ISBN : 978-1-78548-014-0. ⟨10.1016/B978-1-78548-014-0.50004-9⟩. ⟨insu-01154803⟩

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