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Impact of voids in interconnection materials

Pierre-Richard Dahoo 1 Malika Khettab 2 Christian Chong 2 Armelle Girard 3 Philippe Pougnet. 4
1 IMPEC - LATMOS
LATMOS - Laboratoire Atmosphères, Milieux, Observations Spatiales
2 LISV - Laboratoire d'Ingénierie des Systèmes de Versailles
3 LEM - ONERA - CNRS - Laboratoire d'étude des microstructures [Châtillon]
4 Valeo Powertrain Systems
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https://hal-insu.archives-ouvertes.fr/insu-01154803
Contributor : Catherine Cardon <>
Submitted on : Saturday, May 23, 2015 - 5:37:20 PM
Last modification on : Friday, June 26, 2020 - 2:01:07 PM

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  • HAL Id : insu-01154803, version 1

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INSU | CNRS | UPMC | UVSQ | LATMOS | LISV | ONERA | UNIV-PARIS-SACLAY | SORBONNE-UNIVERSITE | SU-SCIENCES

Citation

Pierre-Richard Dahoo, Malika Khettab, Christian Chong, Armelle Girard, Philippe Pougnet.. Impact of voids in interconnection materials. Abdelkhalak El Hami et Philippe Pougnet. Embedded Mechatronic Systems 2. Analysis of Failures, Modeling, Simulation and Optimization, Elsevier, Chapter 4, 2015, ISBN : 978-1-78548-014-0. ⟨insu-01154803⟩

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