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Chalcogenide glasses for mid-IR photonic applications
Nazabal V., Baudet E., Chahal R., Starecki F., Boussard-Plédel C., Verger F., Nemec P., Lhermite H., Charrier J., Adam J.-L. et al
2014 IEEE Photonics Society Summer Topical Meeting Series, Canada (2014) [hal-01020712 - version 1]
Strong, tough and stiff bioinspired ceramics from brittle constituents
Bouville F., Maire E., Meille S., Van De Moortèle B., Stevenson A. J., Deville S.
Nature Materials 13 (2014) 5008-514 [hal-00988803 - version 1]
Practical method, based on measurements of soil (geo)electrical properties, gas content and δ13C(CO2), for monitoring the remediation by bio-stimulation of hydrocarbon-contaminated soils
Noel C., Gourry J.-C., Naudet V., Ignatiadis I., Colombano S., Dictor M. C., Guimbaud C., Dumestre A., Tracol J.-P., Dehez S.
Dans Proceedings of the 12th International UFZ-Deltares Conference on Groundwater-Soil-Systems and Water Resource Management: AquaConSoil Bareclona 2013 - 12th International UFZ-Deltares Conference on Groundwater-Soil-Systems and Water Resource Management, Espagne (2013) [hal-00750324 - version 1]
Patterned Hydrophobic Domains in the Exopolymer Matrix of Shewanella oneidensis MR-1 Biofilms
Aldeek F., Schneider R., Fontaine-Aupart M.P., Mustin C., Lecart S., Merlin C., Block J.-C.
Applied and Environmental Microbiology 79, 4 (2013) 1400-1402. [hal-00807989 - version 1]
Using the anisotropy of magnetic susceptibility to infer flow-induced orientation of anisotropic particles: feasibility and sensitivity
Akkoyun M., Majesté J.-C., Bascou J.
Rheologica Acta 52 (2013) 49-57 [hal-00867684 - version 1]
Liquidus Projection of the B-Fe-U Diagram : The Boron-Rich Corner
Dias M., Carvalho P. A., Bohn M., Tougait O., Noël H., Gonçalves A.
Metallurgical and Materials Transactions A-Physical Metallurgy and Materials Science 44, 1 (2013) 398-405 [hal-00812646 - version 1]
Synchrotron X-ray imaging for crystal growth studies
Baruchel J., Di Michiel M., Lafford T., Lhuissier P., Meyssonnier J., Henri N.T., Philip A., Pernot P., Salvo L., Scheel M.
Comptes Rendus Physique 14, 2-3 (2013) 208-220 [hal-00925853 - version 1]
Bottom-up solution chemistry approaches for nanostructured thermolectric materials
Benoit R., Hornebecq V., Weill F., Lecren L., Bourrat X., Treguer-Delapierre M.
Journal of Materials Chemistry A : Materials for Energy and Sustainability 1, 45 (2013) 14221-14226 [hal-00880782 - version 1]
Microstructural void environment characterization by electron imaging in 45 nm technology node to link electromigration and copper microstructure
Galand R., Brunetti G., Arnaud L., Rouviere J.L., Clement L., Waltz P., Wouters Y.
Microelectronic Engineering 106 (2013) 168-171 [hal-00850231 - version 1]
Effectiveness of wafer level test for electromigration wear out reporting in advanced CMOS interconnects reliability assessment
Bana F., Petitprez E., Ney D., Arnaud L., Wouters Y.
Microelectronic Engineering 106 (2013) 195-199 [hal-00850229 - version 1]